Silicon University / Track A / Pillar 08 · BEOL & Packaging
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BEOL Metallization, Dual Damascene & Low-k
Step 22 of 24 · BEOL Metallization, Advanced 2.5D/3D Packaging & Heterogeneous Integration · three tiers, 55 min total.
BEOL phase
Topic 8.1
3 articles
Tier 1 · Core FundamentalsBEOL Metallization, Dual-Damascene & Low-k Dielectrics: Core Fundamentals
Explains how billions of microscopic transistors on a chip are connected together using up to 15 layers of copper wires embedded inside fragile porous low-k insulating ma…
Tier 2 · Equipment & KinematicsCopper Electroplating, PVD Barrier & Pore Sealing Mechanics
Tool design for magnetron sputtering of TaN/Ta liner and Cu seed layers, fountain-head Electrochemical Deposition (ECD) cells with organic additives (suppressors, acceler…
Tier 3 · Deep-Dive & Yield EngineeringElectromigration, RC Delay & Ultra-Low-k Physics
Chemical analysis of carbon-doped oxide (SiCOH) plasma damage during etching, dielectric constant (k) degradation, copper electromigration (EM) grain boundary diffusion p…