Silicon UniversitySEMICONDUCTOR MANUFACTURING About the project

Fab Flow

101 Quartzite
102 Ingot
103 Wafering
104 FEOL
105 BEOL
106 Packaging

Silicon University / Track B matrix

03

Planarization Tribology & Chemical Mechanical Polishing

Pillar 03 of 8, three topics, nine articles: oxide & polysilicon cmp, copper damascene & barrier cmp, slurry, pad conditioning & cmp metrology.

3 topics9 articles 3 tiers

Topic 3.1 · Oxide & Polysilicon CMP

3 articles · 3 tiers · Track A step 07

Tier 1Oxide and Polysilicon CMP Fundamentals: Achieving Global Planarization12 min

Tier 2Prestonian Kinematics & CMP Tool Architecture: Pressure & Velocity Distribution18 min

Tier 3Tribology & Luo-Dornfeld Abrasive Mechanics: Micro-Scale Material Removal25 min

Topic 3.2 · Copper Damascene & Barrier CMP

3 articles · 3 tiers · Track A step 08

Tier 1Copper Damascene & Barrier CMP Fundamentals: Multi-Step BEOL Integration14 min

Tier 2Barrier Slurry Chemistry & Galvanic Corrosion: Electrochemical Control20 min

Tier 3Dishing & Erosion Tribochemical Models: Sub-10nm Interconnect Topography26 min

Topic 3.3 · Slurry, Pad Conditioning & CMP Metrology

3 articles · 3 tiers · Track A step 09

Tier 1Slurry, Pad Conditioning & CMP Metrology Fundamentals13 min

Tier 2Pad Conditioning, Diamond Wear & Endpoint Metrology Mechanics21 min

Tier 3Colloidal Slurry Stability & Pad Asperity Kinetics: Sub-Nanometer Defectivity27 min

Wide fab floor with rows of white process tools and an engineer handling a wafer cassette at an open tool drawer — FABAutomated wafer handling equipment on the fab floor