Silicon University / Track A / Pillar 06 · Plasma Etching
17
Atomic Layer Etching
Step 17 of 24 · Plasma Etching & Atomic-Scale Material Removal · three tiers, 52 min total.
FEOL phase
Topic 6.2
3 articles
Tier 1 · Core FundamentalsAtomic Layer Etching (ALE): Core Principles & Sub-Nanometer Precision
Explains how ALE achieves sub-nanometer etching precision by separating the chemical reaction into self-limiting surface modification and low-energy ion bombardment displ…
Tier 2 · Equipment & KinematicsALE Tool Architecture: High-Speed Gas Pulsing, Fast-Switching Plasmas & Cycle Control
Hardware mechanics of ALE chambers capable of sub-hundred-millisecond gas pulsing, ultra-fast vacuum purge valves, atomic radical generator modules (Ar, F, Cl), and synch…
Tier 3 · Deep-Dive & Yield EngineeringDirectional Plasma vs. Thermal Isotropic ALE: Surface Chemistry & Reaction Kinetics
Quantitative analysis of surface adsorption saturation limits, thermal ligand-exchange ALE kinetics (HfO_2, Al_2O_3), low-energy ion sputtering threshold boundaries (<30e…